Nekuda kwekusiyana-siyana kwemaitiro epoxy resins, inoshandiswa zvakanyanya mukunamira, potting, encapsulating yemagetsi, uye akadhindwa edunhu mabhodhi. Inoshandiswawo muchimiro chematrices emacomposites mune aerospace maindasitiri. Epoxy composite laminates anowanzo shandiswa kugadzirisa ese ari maviri akaumbwa pamwe chete nesimbi zvimiro mumashandisi emugungwa.
Epoxy resin 113AB-1 inogona kushandiswa zvakanyanya kupfekedza furemu yemifananidzo, crystal flooring coating, zvishongo zvakagadzirwa nemaoko, uye kuzadza mold, nezvimwe.
Feature
Epoxy resin 113AB-1 inogona kuporeswa pasi petembiricha yakajairwa, ine chimiro cheyakaderera viscosity uye yakanaka inoyerera pfuma, yakasikwa defoaming, anti-yellow, high transparency, hapana ripple, inopenya kumusoro.
Properties before Hardening
Chikamu | 113A-1 | 113B-1 |
Color | Transparent | Transparent |
Specific giravhiti | 1.15 | 0.96 |
Viscosity (25 ℃) | 2000-4000CPS | 80 MAXCPS |
Kusanganisa ratio | A: B = 100:33(kurema reshiyo) |
Kuomesa mamiriro | 25 ℃×8H kusvika 10H kana 55℃×1.5H (2 g) |
Nguva yekushandisa | 25℃×40min (100g) |
Operation
1.Weigh A uye B glue maererano nechiyero chehuremu chakapiwa mumudziyo wakagadzirwa wakacheneswa, wakasanganiswa zvakakwana musanganiswa zvakare rusvingo rwemudziyo newachi, uise pamwe chete kwemaminitsi matatu kusvika ku5, uye inogona kushandiswa.
2.Tora glue maererano nenguva inoshandiswa uye chiyero chemusanganiswa kuti urege kuparadza. Kana tembiricha iri pasi pe15 ℃, ndapota pisa A glue kusvika 30 ℃ kutanga uye wozoisanganisa neB glue (A glue ichave yakakora mukupisa kwakadzika); Iyo glue inofanira kuvharwa chivharo mushure mekushandisa kudzivirira kurambwa kunokonzerwa nekunwa kwehunyoro.
3.Kana hunyoro hwehukama hwakakwirira kupfuura 85%, pamusoro pemusanganiswa wakaporeswa unotora unyoro mumhepo, uye kugadzira mhute chena pamusoro, saka kana hunyoro hunenge hwakakwirira kupfuura 85%, haina kukodzera. pakurapa tembiricha yekamuri, kurudzira kushandisa kupisa kupisa.