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Pure Adhesive Liquid 500-033-5 Epoxy Resin 113AB-1 (C11H12O3)n

Short Description:

Main Raw Material:  Epoxy Resin

Product name: (C11H12O3)n

Mixing Ratio: A:B=3:1

Other Names: Epoxy AB Resin

Classification: Double Components Adhesives

Type: Liquid Chemical

Application: Pouring

Acceptance: OEM/ODM, Wholesale, Trade,

Payment: T/T, L/C, PayPal

Our factory has been producing Fiberglass since 1999.We want to be your best choice and your absolutely reliable business partner.

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Product Detail

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Product Application

Because of the versatile properties of epoxy resins, it is used widely in adhesives, potting, encapsulating electronics, and printed circuit boards. It is also used in the form of matrices for composites in the aerospace industries. Epoxy composite laminates are commonly used for repairing both composite as well as steel structures in marine applications.

Epoxy resin 113AB-1 can be widely used for photo frame coating, crystal flooring coating, hand made jewelry, and mold filling, etc..

Feature

Epoxy resin 113AB-1 can be cured under normal temperature, with the feature of low viscosity and good flowing property, natural defoaming, anti-yellow, high transparency, no ripple, bright in surface.

Properties before Hardening

Part

113A-1

113B-1

Color

Transparent

Transparent

Specific gravity

1.15

0.96

Viscosity (25℃)

2000-4000CPS

80 MAXCPS

Mixing ratio

A: B = 100:33(weight ratio)

Hardening conditions

25 ℃×8H to 10H or 55℃×1.5H (2 g)

Usable  time

25℃×40min (100g)

Operation

1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.

2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ℃, please heat A glue to 30 ℃ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.

3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing, suggest to use the heat curing.

Specification and Physical Properties

Properties after Hardening

Hardness, shore D

<85

Withstand voltage, KV/mm

22

Flexural strength, Kg/mm2

28

Volume resistivity, Ohm3

1x1015

Surface resistance, Ohmm2

5X1015

Thermal conductivity, W/M.K

1.36

Induced electric loss, 1KHZ

0.42

Withstand high temperature, ℃

80

Moisture absorption,  %

<0.15

Compressive strength, Kg/ mm2

8.4

Caution
1,The operating environment should be ventilate and should keep away from fire. Closely sealed after use. 

2, Avoid eye contact, in case of contact, wash with plenty of water and get medical attention immediately.

3, If contact skin, wrap with clean cloth or paper, and wash it with water and soap.

4, Keep away from children.

5, Please take a trial before application to avoid usage mistake. 

Packing

Selling Units:Single item

Single package size: 43X38X30 cm
Single gross weight:22.000 kg
Package Type:1kg ,5kg,20kg 25kg per bottle/20kg per set/200kg per bucket

Product Storage and Transportation 

Unless otherwise specified, the epoxy resin products should be stored in a dry, cool and moisture proof area. Best used within 12 months after production date. They should remain in their original packaging until just prior to use. The products are suitable for delivery by the way of ship, train, or truck. 


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