(I) De conceptuepoxy resinae
Epoxy resinae refertur ad Polymer catena structuram continet duo vel epoxy coetus in polymer componit, pertinet ad thermosetting resinae, repraesentativum resinae est Bisphenol genus epoxy resina est.
(II) De characteres epoxy resinam (plerumque referred to as Bishenol a genus epoxy resins)
I. Individui epoxy resinae applicationem valorem valde humilis, necesse est esse in conjunction cum curando agens ad practical valorem.
II. Bonding vires: et vinculum vires epoxy resinae tenaces est ad forefront de Saccharum adhesives.
III. Curationes DECREMENTUM est parva, in tenaces epoxy resina tenaces DECREMENTUM est minima, quae etiam epoxy resina tenaces curatio tenaces summus unus de causis.
IV. Bonum chemical resistentia: et aether Group, benzene anulum et aliphatic hydroxyl coetus in curatione ratio non facile erosis per acidum et alkali. In maris, PETROLEUM, Kerosene, X% H2SO4, X% HCL, X% Hac, X% NH3, X% H3PO4 et XXX% NA2CO3 potest adhiberi duobus annis; Et L% H2SO4 et X% HNO3 immersionem ad locus temperatus ad dimidium annum; X% Naoh (C ℃) immersionem pro uno mense, in perficientur manet immutata.
V. Electrical Electrical Nulla: et naufragii intentione epoxy resinae potest esse maius 35kv / mm VI. Bonum processus perficientur, uber mole stabilitatem, bonum resistentia et humilis aqua effusio. Bisphenol in-genus epoxy resina commoda sunt bona, sed etiam habet incommoda: ①. Operating Viscositas, quae videtur esse aliquantum inconveniens in constructione ②. Curatus materia est fragilis, elongatio est parvum. ③. Humilis cortices vires. ④. Pauperibus resistentia ad mechanica et scelerisque inpulsa.
(III) et applicationem et progressionemepoxy resinae
I. De progressionem historiam epoxy resinae: epoxy resinae applicari pro Helvetica patentibus per p.castam in MCMXXXVIII, in MCMXLVI ad EPOXY in MCMXLIX, et industrialized in MCMLVIII EPOXY in MCMLVIII.
II. Applicationem epoxy resinae: ① coating industria: epoxy resin in coating industria requirit maximae moles aqua-fundatur coatings, pulveris coatings et altum solidum coatings sunt late usus. Potest esse late in Pipeline vasis, automobiles, naves, aerospace, electronics, nugas, et alii industries. ② electrica et electronic industria: epoxy resinae tenaces potest adhiberi electrica velit materiae, ut rectifiers, Transformers, signa potting; Signatio et tutela electronic components; Electromechanical products, velint et vinculum; Signatio et vinculum de gravida; Capacitors, resistors, inductors, superficies pallii. ③ Jewelry auri, artes, ludit bonis industria: potest adhiberi signa, jewelry, trademark, hardware, rackets, piscantur armigeri, ludit bonis, et aliis products. ④ optoelectronic industria: quod potest esse pro encapsulation, implens et vinculum lucis, emittens Diodes (LED) digital fistulae, pixel fistulae, electronic propono, ducitur et alias products. ⑤Construction Industry: Non etiam late in via, pontem, Tabulatum, ferro structuram, constructione, muro coating, matris, Engineering constructione, culturae reliquias reparatione et aliis industria. ⑥ adhesives, sealants et composita agro: ut ventus Turbine lamina, handicrafts, LATERAMEN, speculum et alia genera vinculum inter substantias, carbonis fibra sheet, et in.
(I) De characteresepoxy resinae tenaces
1. epoxy resin adhesive is based on the epoxy resin characteristics of reprocessing or modification, so that its performance parameters in line with the specific requirements, usually epoxy resin adhesive also need to have a curing agent with in order to use, and need to be mixed uniformly in order to be fully cured, generally epoxy resin adhesive known as the A glue or the main agent, the curing agent known as the B glue or curing agent (Hardener).
II. Reflectendo principalis characteres de epoxy resinae tenaces ante curando sunt: color, viscositas, specifica gravitas, Ratio, gel tempore, available tempore, curatio tempus, Timotropy (subsisto et sic in. Viscosity (Viscosity): est internum frictional resistentia de colloid in fluxus, eius valore determinatur per rationem substantiae, temperatus, concentration et alia factores.
Gel temporeEt curatio de glutine est processus of transformatio a liquido ad solidificationem, ab initio reactionem ad gluten ad discrimine statum gel tendit ad solidum tempus ad gelum resinae gluten, temperatus et alias resin gluten, temperatus et alia resinae gluten, temperatus et alia resin gluten, temperatus et alia resin gluten, temperatus et alia resin gluten, temperatus et alias resinae gluten, temperatus et alia resin gluten, temperatus et alia resin gluten, temperatus et alia resinae gluten, temperatus et alia resin gluten, temperatus et alias.
THIXOTROPHY: This characteristic refers to the colloid touched by external forces (shaking, stirring, vibration, ultrasonic waves, etc.), with the external force from thick to thin, when the external factors to stop the role of the colloid back to the original when the consistency of the phenomenon.
DuritiesRefert ad resistentiam de materia ad externa viribus ut embossing et scalpendo. According to the different test methods Shore (Shore) hardness, Brinell (Brinell) hardness, Rockwell (Rockwell) hardness, Mohs (Mohs) hardness, Barcol (Barcol) hardness, Vickers (Vichers) hardness and so on. The value of hardness and hardness tester type related to the commonly used hardness tester, Shore hardness tester structure is simple, suitable for production inspection, Shore hardness tester can be divided into A type, C type, D type, A-type for measuring soft colloid, C and D-type for the measurement of semi-hard and hard colloid.
Superficiem tensioEt attraction moleculis in liquidum ut moleculis super superficiem interioris vi, haec vis facit liquidum quantum fieri potest ad redigendum superficiem et formationem parallelae superficiei vis, ut superficiem tensionem. Aut mutua tractu inter duas adiacentibus superficiei liquoris per unitatis longitudo, manifestatio mocecular vi. Quod unitas superficiem tensio est n / m. Magnitudinem superficiem tensio est ad naturam, puritas et temperatus ad liquorem.
III. Reflecting in characteresepoxy resinae tenacesafter curing the main features are: resistance, voltage, water absorption, compressive strength, tensile (tensile) strength, shear strength, peel strength, impact strength, heat distortion temperature, glass transition temperature, internal stress, chemical resistance, elongation, shrinkage coefficient, thermal conductivity, electrical conductivity, weathering, aging resistance, and so on.
Resistentia: Describere materiam resistentia characteres plerumque cum superficiem resistentia vel volumine resistentia. Superficiem resistentia est simpliciter idem superficies inter duo electrodes metiri resistentia valorem, quod unitas est ω. Et figura ex electrode et resistentia valorem potest esse ratione per combining superficiem resistivity per unitas regio. Volubilis resistentia, etiam quae volumus resisto, volumine resistentia coefficientem, refert resistentia valorem per crassitiem in materia, est momenti indicator est characterizare electrica proprietatibus de Dielectric vel insulating materiae. Est momenti Index ad proprietates electrica proprietatibus et insulating materiae dielectric. 1cm2 dielectric resistentia ad Leakage current, unitas est ω-m et ω-cm. Et maior resisto, in melius insulating proprietatibus.
Probatur voltage: Etiam ut resistere voltage vires (Nulla vires), superiore voltage addita ad fines de Colloid, maior in causam in materia subiicitur ad electrica agro, magis verisimile est in collisione, inde in navalibus de collisis. Facere insulator naufragii infimissima intentione dicitur obiectum naufragii voltage. Fac I mm crassus insulating materia naufragii, opus addere voltage kilovolts vocatur insulating materiam velit resistere voltage vires, referred to as resistere voltage, quod unitas est: KV / mm. Insulating materiam velit et temperatus habent propinquus necessitudinem. In altiorem temperatus, in deterius in insulatione perficientur de insulating materia. Ut ad invigilandum in tortor fortitudo, quisque insulating materia habet convenientem maximum licita operantes temperatus, in hoc temperatus infra, potest adhiberi tuto diu, magis quam hoc temperatus esse cursim senescit.
Aqua effusio: Est mensura quantum ad quod materia absorbet aquam. Refert ad recipis incremento in mole substantiae immersa in aquam in quadam tempus ad quaedam temperatus.
Tensile viribus: Tensile vires est maximum distrahentes accentus cum gel est extenta ut conteram. Quoque notus ut tensile vis, tensile vires, tensile vires, tensile vires. Unitas est MPA.
Shear Fortitudo: Etiam ut tondendas vires, refert ad unitatis ad bonding area potest resistere maximum onus parallel ad vinculum regio, communiter unitas unitas in MPA.
Cortices fortitudinem: Etiam ut cortices fortitudo, est maximum damnum onus per unit width potest sustinere, est mensura linea vis facultatem, quod unitas est kn / m.
ElongatioRefers ad colloid in tensile vis in actione longitudinis incrementum in originali longitudinem recipis.
Calor deflexio temperatus: refers to a measure of heat resistance of the curing material, is a curing material specimen immersed in a kind of isothermal heat transfer medium suitable for heat transfer, in the static bending load of the simply supported beam type, measured the specimen bending deformation to reach the specified value of the temperature, that is, the heat deflection temperature, referred to as the heat deflection temperature, or HDT.
Vitrum transitus temperatus: Refers ad curatum materia ex speculo forma ad amorpho vel altus elastica aut fluidum rei publicae transitus (vel oppositum transitus) angustum temperatus rhoncus temperatus adeo, ut speculum transitus caloris resistentia.
DECREMENTUM: Defined sicut recipis ratio DECREMENTUM ad magnitudinem ante DECREMENTUM et DECREMENTUM est differentia inter magnitudinem ante et post DECREMENTUM.
Internus accentus: De absentia externa viribus, in colloid (materia) debitum ad praesentiam defectus, temperatus mutationes, solvents et aliis causis ad internum accentus.
Chemical resistentiaRefers ad facultatem resistere acida, alkalis, sales, solvents et alias alchicals.
Flamma resistentia: Refert ad facultatem ad resistere combustione cum in contactu cum flamma vel impedire continuationem combustionis cum a flamma.
Tempestas resistentiaRefert ad materiam nuditate solis, calor et frigus, ventus et pluvia et alia climatica condiciones.
Senectus: curing colloid in the processing, storage and use of the process, due to external factors (heat, light, oxygen, water, rays, mechanical forces and chemical media, etc.), a series of physical or chemical changes, so that the polymer material crosslinking brittle, cracking sticky, discoloration cracking, rough blistering, surface chalking, delamination flaking, the performance of the gradual deterioration of the Mechanica proprietatibus damnum damnum potest esse, hoc phaenomenon dicitur senescit. Et phaenomenon huius mutatio dicitur senescit.
Dielectric constant: Etiam notum ut capacitance rate, adductus rate (permittit). Refers to se "unitas volumine" de obiecto, in se unitas in "potentiale gradientis" potest salvare "electrostatic industria" (electrostatic industria) de quantum. When the colloid “permeability” the greater (that is, the worse the quality), and two close to the wire current work, the more difficult to reach the effect of complete insulation, in other words, the more likely to produce some degree of leakage. Igitur dielectric assidue insulating materiales in generali, minor est. Et dielectric constans aquae est LXX, multo minus humorem, et faciam significant mutationes.
IV. Maxime deepoxy resinae tenacesEst calor-occasum tenaces, quod habet sequuntur principalis features: et altior temperatus celerius curationes; mixta moles magis citius curatio; Et curatio processus habet exothermic phaenomenon.
Shanghai Orisen Novum Material Technology Co., Ltd
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Post tempus: Oct-31-2024