(I) ka manaʻo oResin Resin
Hoʻokomoʻia ka resin resin epyx i ka hoʻolālāʻana o ka polymer chocture heʻelua aʻoi aku paha nā hui epomet i loko o ka consophous
(Ii) nā hiʻohiʻona o nā resins epoxy (maʻamau i kapaʻiaʻo Bisphenol kahi Resins epoxnol.
1. He haʻahaʻa loa ka waiwai o ka noi noi epoxy. Pono ia e hoʻohanaʻia ma Conjunction me kaʻoihana curing e loaʻa ai ka waiwai kūpono.
2.ʻO ka ikaika kiʻekiʻe loa
3. He liʻiliʻiʻo Cherning Shrik
4.ʻO ka paleʻana o ka chectical:ʻo ka hui o Eter Group, Benzene Ring a me Aliphachatic Hydroxyl Group ma ka'ōnaehana curing a me Alkali. I loko o kahi kai, Petroleum, Keronne a ma 50% H2SHO4 a me 10% Mno3 inimia i ka mahana o ka lumi no ka hapalua makahiki; 10% Naoh (100 ℃) i ka mea nāna i hoʻopuka i hoʻokahi mahina,ʻaʻole i loliʻole ka hana.
5 ʻO Bisphenol a-type epoxy resin resin he maikaʻi, akāʻo ia nō ka loaʻaʻana o kāna mau hemahema: ①. ʻO ka heleʻana o ka hanaʻana,ʻo ia ka mea iʻikeʻia e lilo i maopopo i ka hana ②. ʻO ka mea i ho'ōlaʻia, he liʻiliʻi ka holoiʻana. ③. Hoʻohaʻahaʻa haʻahaʻa haʻahaʻa. ④. Ka pale hewa i ka mechanical a me ka haʻalulu thermal.
(Iii) ka noi a me ka hoʻomohalaʻana oResin Resin
1. Ua hoʻomakaʻia ka mōʻaukala hoʻomohalaʻana o Epoxy Rest: Ua hoʻokumuʻiaʻo Epoxy Resin no ka P.Deam i hoʻomohalaʻia e ka makahiki 1949, a ua hoʻomakaʻia ka hana o ka epoxy i ka makahiki 1958.
2.ʻO ka noi o Epoxy Resin: Hiki ke hoʻohana nuiʻia ma ka pipeline i nā mea hana pipeline, nā kaʻa, nā moku, nā mea uila, nā mea hana a me nā mea hana'ē aʻe. ②ʻO kaʻoihana uila a me ka uila uila: Hiki ke hoʻohanaʻia ka adhesive resin adhesive i nā mea lapaʻau uila ka hōʻailonaʻana a me ka pale o nā'āpana uila; Nā huahana Online0menha, e hoʻohuli a me ka kauʻana; e waiho ana a me ka paleʻana i nā pā; Nā CaileCraniu, nā mea kipi, nā mea kanu, nā mea kanu, kaʻaoʻao o ke kolo. ③ʻO nā mea kūʻai gula gula, nā hana hana hana, nāʻoihana hana hāmeʻa: hiki ke hoʻohanaʻia no nā hōʻailona, nā mea kanu, nā mea kanu a me nā mea hana hana a me nā mea hana ④ optoectchercher Industry ʻO kaʻoihanaʻo ⑤riston: e hoʻohana nuiʻia nō hoʻi i ke alanui, keʻano, ka papaʻaina, ka papa hana hana a me nāʻoihanaʻoihana. ⑥ Kalepa, nāhelehele a me nā hui hui: e like me nā'āpana o nā aniani, nāʻano'āpana a me nā mea hoʻohālike
(Iv) nā hiʻohiʻona oʻO ka hoʻoponoponoʻana o ka epoxy resin
1. E pili ana i nā loiloi resin epoixy e pili ana i nā mea e pili ana i ka hoʻoponoponoʻana, a iʻole nā koina o ka epoiy ʻO B Glue a iʻole nā mea hoʻokele Curing (Hardenner).
2. E noʻonoʻo ana i nā hiʻohiʻona nui o ka epoxy resin resin ma mua o ka curing ʻO Viscosity (Viscosity)
Time gel:ʻO ke kāʻei o ka glue ke kaʻina o ka hoʻololiʻana mai ka wai e hoʻoponopono ai, mai ka manawa kūpono o ka gel
Thixotopy:ʻO kēia hiʻohiʻona e pili ana i ka collid i hoʻopāʻia e nā pūʻali koa o waho mai ka papa o ka colled
Hālulu: e pili ana i ke kū'ēʻana i nā mea i loko o nā mea o waho e like me ka embossing a me ke kāwiliʻana. Wahi a nāʻano hōʻike hōʻike likeʻole (Shore) paʻakikī, brinell (brarine ʻO keʻano o ka paʻakikī a me ka paʻakikī paʻakikī e pili ana i ka hana koʻikoʻi.
Pā'ā'āʻaʻia: keʻano o nā molepula i loko o ka wai wai no ka laweʻana i ka wai o ka ikaika, e like me keʻano o kaʻili o ka ikaika. A iʻole ka neʻeʻana i waena o nā'āpanaʻelua o nā'āpana o ka wai o ka wai no ka lōʻihi o ka wai ʻO ka'āpana o ka papa o ka pae o keʻano he n / m. ʻO ka nui o keʻano o ka hoʻohālikelikeʻana e pili ana i keʻano, maʻemaʻe a me ke ea o ka wai.
3. E wehewehe ana i nā hiʻohiʻona oʻO ka hoʻoponoponoʻana o ka epoxy resinMa hope o ka hoʻohuliʻana i nā hiʻohiʻona nui: Kaomi, me ka ikaika o ka wai, ka maʻi kūlohelohe, a me keʻano kūmole, ka nānāʻana, a me keʻano kūmole, emcation,
Kū kū'ē: E wehewehe i nā hiʻohiʻona o nā hiʻohiʻona piliʻana me ka paleʻana i ka pale a iʻole ka paleʻana o ka nui. ʻO ka paleʻana o ke kū'ē i kaʻaoʻao ma waena o nā electrodes i heluʻia e pili ana i ka waiwai o nā koho balota,ʻo ia ka'āpana ω. Hiki ke heluʻia keʻano o ka electrode a me keʻano o keʻano o keʻano o ka hoʻohuiʻana i ka paleʻana i ka pale o ka pae. ʻO nā kūmole kūwaho,ʻikeʻiaʻo ia e like me ka nui o ka paleʻana, e pili ana i keʻano o ka waiwai o ka cectric a iʻole ka hoʻohālikelikeʻana i nā mea waiwai. He hōʻailona nui ia e hōʻike i nā waiwai uila o nā mea uila 1cm2 diectric reistsc resistist i ka leakage i kēia manawa,ʻo ia ka'āpana ω-m a ω-cm. ka nui loa o ka pale,ʻoi aku ka maikaʻi o nā waiwai insulating.
Hōʻike hōʻoia: Uaʻikeʻiaʻo ia e like me ka ikaika o ka ikaika ma ka ikaika),ʻoi aku ka kiʻekiʻe o keʻano i loko o ka pahū uila, e hopena i ka wāwahi E hoʻolōʻihi i ka slarulator i keʻano o ka voltage haʻahaʻa i kapaʻiaʻo ia i keʻano o ka uila wāwahi. Hana i ka 1 mm paila i hoʻopaʻaʻia i nā mea i wāwahiʻia, pono e hoʻohui i nā kilovolts i kapaʻiaʻo ka hōʻoiaʻana i ka waiwai ʻO ka hoʻohālikelikeʻana i nā mea hoʻonāukiuki a me ka mahana i kahi pilina pili. ʻOi aku ke kiʻekiʻe o ke mahana,ʻo kaʻoi aku ka maikaʻi o ka hanaʻana i ka hana o ka mea hoʻonāukiuki. I mea e hōʻoiaʻiʻo ai i ka ikaika o ka hoʻonāukiuki, aia i kēlā me kēia mea e pono ai keʻano hana kūpono, ma lalo o kēia mahana, hiki ke hoʻohanaʻia ma mua o kēia mahana.
Ka wai wai: He ana o ka nui o ka wai i ka wai. E pili ana i ka hoʻonuiʻana i ka pakeneka ma ka nui o kahi mea i hoʻopiʻiʻia i loko o ka wai no kekahi manawa o kekahi manawa ma kekahi manawa.
Ikaika ikaika:ʻO ka ikaikaʻo Tessileʻo ia ka nui o ke kaumaha kiʻekiʻe loa i ka wā e pau ai ka gel. Kūkākūkāʻiaʻo AS Tonsile ikaika, Timsele ikaika,ʻehaʻeha, Sunshile. Unit ka MPA.
Ka ikaika: Uaʻikeʻiaʻo ia eʻoi aku ka ikaika o ka ikaika, e pili ana i ka pae o ka'āina e hiki ke hoʻopaʻaʻia i ka paepae nui loa i ka pae o MPA.
Ikaika ikaika: Uaʻikeʻiaʻo Peel ikaika,ʻo ia ka nui o ka hoʻoukaʻana ma ka laulā o kēlā me kēia paepae,ʻo keʻano o ka laina o ka ikaika
Ewangantion: e pili ana i ka colloid i ka ikaika o ka tensile ma lalo o ka hana o ka lōʻihi o ka piʻiʻana o ka hapanui o ka pakeneka.
Wela wela wela: E pili ana i ke anaʻana o ka wela o ka wela o ka curing mea, he mea kūʻai nui loa o keʻano o keʻano o keʻano o ka wela
Ke aniani o ke aniani: e pili ana i ka mea i mālamaʻia mai keʻano aniani i ka mahana o ke aniani.
Shlanction ration: i weheweheʻia e like me ka hapa o ka pae o ka hōʻiliʻiliʻana i ka nui ma mua o ka hōʻiliʻiliʻana, aʻo ka wela kaʻokoʻa ma waena o ka nui ma mua a ma hope o ka nui o ka nui.
ʻO ke kaumaha kūloko: E pili ana i ka haʻaleleʻana o nā pūʻali koa o waho, ka collod
Ke kū'ē kū'ē: e pili ana i ka hiki ke pale aku i nā maʻi, alkalis, paʻakai, nā mea kanu a me nā mea kanu'ē aʻe.
Slame resistornce: e pili ana i ka hiki i ka pono ke pale aku i ka hoʻopiliʻana i ka wā e hoʻopili ai me kahi flame a iʻole e hoʻonāukiuki i ka hoʻomauʻana mai kahi ahi.
Ke kū'ēʻana: e pili ana i kaʻikeʻana i nā mea i ka lā, wela a me ke anuanu, ka makani a me ka ua a me nā ua a me nā kūlana'ē aʻe.
ʻEhā: curing colloid i ka hoʻoiliʻana, mālama a hoʻohana i nā mea hana kino, e like me nā mea kanu kino, no laila keʻano o keʻano o ke aniani nā waiwai o ka nalowale o ka nalowale o ka nalowale o ka hikiʻole ke hoʻohanaʻia, ua kapaʻia kēia mea i kapaʻiaʻo ia. Ua kapaʻia ka phenonieon o kēia loli.
'Āpana Hoʻolālā: Uaʻikeʻiaʻo ia e like me ka helu hiki, hoʻohuiʻia i ka helu helu (ʻaeʻia). E pili ana i kēlā me kēia "papa helu helu" o ka mea, ma kēlā me kēia papa o ka "cirdien" hiki ke mālama i ka "electrosticic ikehu" I ka wā i loaʻa ai ka colloid "i ka nui (ʻo ia hoʻi,ʻoi aku ka maikaʻi o keʻano o ka loaʻaʻana o ka hanaʻana i kēia manawa. No laila,ʻo ka luna o ka everlacectric o nā mea e hoʻonāukiuki i ka mea nui,ʻo ka mea liʻiliʻi loa. ʻO ka nui o kaʻaiʻana o ka wai he 70, liʻiliʻi liʻiliʻi, e kumu i nā loli nui.
4.ʻO ka hapa nui o kaʻO ka hoʻoponoponoʻana o ka epoxy resinHe wela hinu-ke ku i na mea hou ae, ua like ia mahope ae ka oihana: E akahai i na oiuhau ka oi kaua; he nui a oi aku ka nui o ka wikiwiki o ka curing; ʻO ke kaʻina hana curing he nui exothermic phenomenon.
Shanghai Orisen houʻenehanaʻenehana Cocial Cover Technology Co., Ltd
M: +86 18683776368 (he whatsapp)
T: +86 08383999999
Email: grahamjin@jhcomposites.com
Address: No.398 New Green Road Xinbang Town Songjiang Apana, Shanghai
Post manawa: Oct-31-2024