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ʻIke kumu o nā Epoxy Resins a me Epoxy Adhesives

(I) Ka manaʻo oepoxy resin

ʻO ka resin epoxy e pili ana i ke kaulahao polymer i loaʻa i ʻelua a ʻoi aku nā pūʻulu epoxy i loko o nā pūhui polymer, nona ka resin thermosetting, ʻo ka resin representasi he bisphenol A ʻano epoxy resin.

(II) Nā hiʻohiʻona o nā resins epoxy (i kapa mau ʻia ʻo bisphenol A type epoxy resins)

epoxy resins

1. He haʻahaʻa loa ka waiwai o ka noi epoxy resin, pono e hoʻohana pū me ka mea ho'ōla e loaʻa ka waiwai kūpono.

2. ʻO ka ikaika hoʻopaʻa kiʻekiʻe: ʻo ka ikaika hoʻopaʻa ʻana o ka epoxy resin adhesive ma ke alo o nā synthetic adhesives.

3. Curing shrinkage mea uuku, ma ka epoxy resin adhesive shrinkage ka mea liilii loa, a me ka epoxy resin adhesive curing adhesive kiʻekiʻe kekahi o nā kumu.

4. ʻO ke kūpaʻa kemika maikaʻi: ʻo ka hui ether, ke apo benzene a me ka hui aliphatic hydroxyl i loko o ka ʻōnaehana hoʻōla ʻaʻole hiki ke hoʻopau ʻia e ka waikawa a me ka alkali. I ka wai kai, ka aila, ka aila, 10% H2SO4, 10% HCl, 10% HAc, 10% NH3, 10% H3PO4 a me 30% Na2CO3 hiki ke hoohana no na makahiki elua; a i loko o 50% H2SO4 a me 10% HNO3 immersion ma ka lumi wela no ka hapalua makahiki; 10% NaOH (100 ℃) immersion no hoʻokahi mahina, ʻaʻole i loli ka hana.

5. ʻOi aku ka maikaʻi o ka uila uila: hiki ke ʻoi aku ka nui o ka haʻihaʻi o ka epoxy resin ma mua o 35kv / mm 6. ʻO ka hana maikaʻi o ka hana, ka nui o ka huahana, kūpaʻa maikaʻi a me ka haʻahaʻa haʻahaʻa wai. ʻO ka maikaʻi o ka bisphenol A-type epoxy resin maikaʻi, akā aia nō kona mau hemahema: ①. ʻO ka viscosity hana, i ʻike ʻia he mea kūpono ʻole i ka hana ②. He palupalu nā mea i hoʻōla ʻia, liʻiliʻi ka elongation. ③. Ka ikaika peel haʻahaʻa. ④. Ke kū'ē maikaʻiʻole i ka mechanical a me ka wela.

(III) ka noi a me ka hoʻomohala ʻana oepoxy resin

1. ʻO ka mōʻaukala hoʻomohala o ka epoxy resin: ua hoʻohana ʻia ka epoxy resin no Swiss patent e P.Castam i 1938, ka mua o ka epoxy adhesive i hoʻomohala ʻia e Ciba ma 1946, a ua hoʻomohala ʻia ka epoxy coating e SOCreentee o USA i 1949, a me ka Ua hoʻomaka ʻia ka hana ʻana o ka epoxy resin i ka makahiki 1958.

2. Ka hoʻohana ʻana i ka resin epoxy: ① ʻO ka ʻoihana hoʻopili: ʻo ka epoxy resin i ka ʻoihana hoʻopiʻi e koi i ka nui o ka nui o ka wai i hoʻopaʻa ʻia i ka wai, ʻoi aku ka nui o ka hoʻohana ʻia ʻana o ka pauka a me ka paʻa paʻa kiʻekiʻe. Hiki ke hoʻohana nui ʻia i nā ipu pipeline, nā kaʻa, nā moku, aerospace, electronics, nā mea pāʻani, nā mea hana a me nā ʻoihana ʻē aʻe. ② ʻoihana uila a me ka uila: hiki ke hoʻohana ʻia ka epoxy resin adhesive no nā mea hoʻokalakupua uila, e like me nā mea hoʻoponopono, nā mea hoʻololi, ke hoʻopaʻa ʻana i ka ipuhao; ka hoʻopaʻa ʻana a me ka pale ʻana i nā mea uila; nā huahana electromechanical, insulation a me ka hoʻopaʻa ʻana; ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana o nā pā; capacitors, resistors, inductors, ka ʻili o ka ʻahuʻula. ③ ʻO nā mea gula, nā mea hana, nā ʻoihana haʻuki: hiki ke hoʻohana ʻia no nā hōʻailona, ​​​​mea nani, nā hōʻailona, ​​​​mea hana, nā rackets, nā mea lawaiʻa, nā mea haʻuki, nā mea hana a me nā huahana ʻē aʻe. ④ ʻOihana Optoelectronic: hiki ke hoʻohana ʻia no ka encapsulation, ka hoʻopiha a me ka hoʻopaʻa ʻana o nā kukui-emitting diodes (LED), nā pahu kikohoʻe, nā pika pika, nā hōʻike uila, nā kukui LED a me nā huahana ʻē aʻe. ⑤ ʻOihana hana: E hoʻohana nui ʻia ia ma ke alanui, ke alahaka, ka papahele, ka hale kila, ke kūkulu ʻana, ka uhi ʻana i ka pā, ka pā, ka hana ʻenekinia, ka hoʻoponopono ʻana i nā moʻomeheu moʻomeheu a me nā ʻoihana ʻē aʻe. ⑥ Nā mea hoʻopili, nā mea hoʻopaʻa a me nā mea hoʻohui: e like me ka makani turbine blades, nā mea hana lima, nā seramika, nā aniani a me nā ʻano ʻano like ʻole o ka hoʻopaʻa ʻana ma waena o nā mea, carbon fiber sheet composite, microelectronic material sealing a pēlā aku.

ka hoʻohana ʻana i ka resin epoxy

(IV) Nā hiʻohiʻona oepoxy resin adhesive

1. epoxy resin adhesive ua hoʻokumu 'ia ma luna o ka epoxy resin ano o ka reprocessing a hoololi paha, no laila, i kona hana 'ana ma ka laina me ka kiko'ī koi, maʻamau epoxy resin adhesive no hoi pono e loaʻa i ka lāʻau lapaʻau me i mea e hoʻohana, a pono e e hui like ʻole i mea e ola pono ai, ʻo ka epoxy resin adhesive i ʻike ʻia ʻo ka glue A a i ʻole ka mea hana nui, ka lāʻau hoʻōla i ʻike ʻia ʻo ka B glue a i ʻole ka lāʻau lapaʻau (hardener).

2. e noʻonoʻo ana i nā hiʻohiʻona nui o ka epoxy resin adhesive ma mua o ka hoʻōla ʻana, ʻo ia ka: kala, viscosity, gravity kikoʻī, ratio, manawa gel, manawa loaʻa, manawa hoʻōla, thixotropy (stop flow), paʻakikī, ʻili ʻili a pēlā aku. ʻO Viscosity (Viscosity): ʻo ia ke kū'ē kū'ē kūloko o ka colloid i ke kahe, ua hoʻoholo ʻia kona waiwai e ke ʻano o ka mea, ka mahana, ka ʻike a me nā mea ʻē aʻe.

Ka manawa gel: ʻO ka hoʻōla ʻana o ke kāpili ke kaʻina o ka hoʻololi ʻana mai ka wai a hiki i ka solidification, mai ka hoʻomaka ʻana o ka hopena o ke kolu a hiki i ke kūlana koʻikoʻi o ka gel i ka manawa paʻa no ka manawa gel, i hoʻoholo ʻia e ka hui ʻana o ka resin epoxy. ke kāpili, ka mahana a me nā mea'ē aʻe.

Thixotropy: ʻO kēia hiʻohiʻona e pili ana i ka colloid i hoʻopā ʻia e nā mana o waho (ka lulu, ka hoʻoulu ʻana, ka haʻalulu, nā hawewe kani ultrasonic, a me nā mea ʻē aʻe), me ka ikaika o waho mai ka mānoanoa a hiki i ka lahilahi, i ka wā e hoʻopau ai nā kumu o waho i ke kuleana o ka colloid i ka wā mua. ke kūlike o ka hanana.

ʻoʻoleʻa: pili i ke kū'ē o ka mea i nā mana o waho e like me ka embossing a me ka scratching. E like me nā ʻano hoʻokolohua like ʻole ʻo Shore (Shore) hardness, Brinell (Brinell) hardness, Rockwell (Rockwell) hardness, Mohs (Mohs) hardness, Barcol (Barcol) hardness, Vickers (Vichers) hardness a pēlā aku. ʻO ka waiwai o ka paʻakikī a me ka paʻakikī paʻakikī e pili ana i ka mea ho'āʻo paʻakikī i hoʻohana mauʻia, He mea maʻalahi keʻano o ka ho'āʻo paʻakikī o Shore, kūpono no ka nānāʻana i ka hana, Hiki ke hoʻokaʻawaleʻia ka mea hōʻike paʻakikī i keʻano A, C type, D type, A-type no ke ana palupalu. colloid, C a me D-ʻano no ke ana ʻana i ka colloid semi-paʻakikī a paʻakikī.

ʻO ka ʻili o ka ʻili: ka huki ʻana o nā molekala i loko o ka wai i hiki ai i nā molekala ma luna o ka ʻili o loko ke ikaika, ʻo kēia ikaika e hana i ka wai e like me ka hiki ke hoʻemi i kona ʻili a me ka hoʻokumu ʻana o ka parallel me ka ʻili o ka ikaika, i kapa ʻia ʻo ʻili ʻili. A i ʻole ka traction like ʻana ma waena o ʻelua mau ʻāpana pili o ka ʻili o ka wai no ka lōʻihi o ka lōʻihi, he hōʻike ia o ka ikaika molekala. ʻO ka ʻāpana o ka ʻili o ka ʻili he N/m. ʻO ka nui o ka ʻili o ka ʻili e pili ana i ke ʻano, ka maʻemaʻe a me ka mahana o ka wai.

3. e hoike ana i na ano oepoxy resin adhesivema hope o ka ho'ōla 'ana i nā hi'ohi'ona nui: ke kū'ē, ka uila, ka wai absorption, ka ikaika compressive, ka tensile (tensile) ikaika, ka ikaika shear, ka ikaika peel, ka ikaika o ka hopena, ka wela distortion wela, ka mahana hoʻololi aniani, ke koʻikoʻi kūloko, ke kūʻē kemika, elongation, shrinkage coefficient , thermal conductivity, uila conductivity, weathering, aging resistance, a pēlā aku.

 epoxy resins

Kūʻē: E wehewehe i nā hiʻohiʻona kūʻokoʻa mea maʻamau me ke kū ʻana o ka ʻili a i ʻole ke kūpaʻa leo. ʻO ke kūʻē ʻana o ka ʻili he ʻili like ma waena o nā electrodes ʻelua i ana i ka waiwai kūʻē, ʻo Ω ka mea. Hiki ke helu ʻia ke ʻano o ka electrode a me ka waiwai kū'ē ma ka hoʻohui ʻana i ka resistivity ili ma kēlā me kēia ʻāpana. ʻO ke kū'ē leo, i ʻike ʻia ʻo ka volume resistivity, volume resistance coefficient, e pili ana i ka waiwai kū'ē ma o ka mānoanoa o ka mea, he hōʻailona koʻikoʻi e ʻike i nā waiwai uila o nā mea dielectric a insulating. He kuhikuhi koʻikoʻi ia e ʻike ai i nā waiwai uila o nā mea dielectric a i ʻole insulating. ʻO 1cm2 dielectric kū'ē i ka leakage au, ʻo Ω-m a i ʻole Ω-cm ka wae. ʻoi aku ka nui o ka resistivity, ʻoi aku ka maikaʻi o nā waiwai insulating.

Volta hōʻike: ʻike ʻia hoʻi ʻo ka ikaika kūʻokoʻa (ka ikaika insulation), ʻoi aku ka kiʻekiʻe o ka volta i hoʻohui ʻia i nā wēlau o ka colloid, ʻoi aku ka nui o ka hoʻopiʻi i loko o ka mea i kau ʻia i ka ikaika kahua uila, ʻoi aku ka nui o ka ionize i ka hui ʻana, ka hopena ka haki ʻana o ka colloid. E hana i ka insulator breakdown o ka haʻahaʻa haʻahaʻa i kapaia ka mea o ka breakdown voltage. Hana i 1 mm mānoanoa insulating mea wawahi, pono e hoʻohui i ka volta kilovolts i kapaia insulating mea insulation kū i ka ikaika voli, i oleloia e like me ke kuʻe uila, ka wae: Kv/mm. insulating mea insulation a me ka wela ka pilina pili. ʻO ke kiʻekiʻe o ka mahana, ʻoi aku ka maikaʻi o ka hana insulation o ka mea insulating. I mea e hōʻoiaʻiʻo ai i ka ikaika o ka insulation, loaʻa i kēlā me kēia mea insulating kahi mahana hana kūpono i ʻae ʻia, i kēia mahana ma lalo nei, hiki ke hoʻohana palekana ʻia no ka manawa lōʻihi, ʻoi aku ka wikiwiki o kēia mahana.

Ka hoʻoheheʻe wai: He ana ia o ka nui o ke komo ana o ka wai. E pili ana ia i ka pākēneka o ka piʻi ʻana o ka nuipaʻa o kahi mea i hoʻokomo ʻia i loko o ka wai no kekahi manawa ma kahi mahana.

Ka ikaika tensile: ʻO ka ikaika tensile ke koʻikoʻi tensile kiʻekiʻe loa i ka wā e kikoo ʻia ka gel e haki. ʻIke ʻia hoʻi ʻo ka tensile force, tensile strength, tensile strength, tensile strength. ʻO MPa ka ʻāpana.

Ka ikaika shear: ʻike ʻia hoʻi ʻo ka ikaika shear, pili i ka ʻāpana hoʻopaʻa ʻāpana hiki ke kū i ka haʻawe kiʻekiʻe e like me ka wahi hoʻopaʻa, hoʻohana mau ʻia ka ʻāpana o MPa.

Ka ikaika ʻili: ʻike ʻia hoʻi ʻo ka ikaika peel, ʻo ia ka nui o ka hōʻeha pōʻino i kēlā me kēia ʻāpana ākea hiki ke kūpaʻa, ʻo ia ke ana o ka laina o ka mana ikaika, ʻo ka ʻāpana kN / m.

ʻO ka elongation: e pili ana i ka colloid i loko o ka ikaika tensile ma lalo o ka hana o ka lōʻihi o ka hoʻonui i ka lōʻihi kumu o ka pakeneka.

Wela deflection wela: e pili ana i ke ana o ke ku'e wela o ka mea hoola, he mea hoola i ke ano i hookomoia iloko o ke ano o ka isothermal heat transfer medium kupono no ka wela, ma ka haawe static bending o ke ano kaola i kokua wale ia, ana i ka specimen bending deformation i. hiki i ka waiwai i kuhikuhi ʻia o ka mahana, ʻo ia hoʻi, ka wela wela, i kapa ʻia ʻo ka wela wela, a i ʻole HDT.

Ke aniani hoʻololi wela: e pili ana i ka mea i hoolaia mai ke ano aniani a hiki i ka amorphous a i ole elastic nui a i ole ka hoololi ana i ka wai (ai ole ia o ka hoololi ana) o ka laula wela haiki o ka lae waena, i ikeia o ka wela hoololi aniani, i hoike pinepine ia ma. ʻO Tg, he hōʻailona o ka pale wela.

ʻAi ʻai hoʻoemi: ho'ākāka 'ia e like me ka pakeneka o ka lakio o ka shrinkage i ka nui ma mua o shrinkage, a shrinkage ka okoa ma waena o ka nui ma mua a ma hope o shrinkage.

ʻO ke kaumaha o loko: e pili ana i ka nele o na ikaika o waho, ka colloid (mea) ma muli o ke alo o na hemahema, ka hoololi ana o ka wela, ka solvents, a me na kumu e ae no ke kaumaha o loko.

Kūleʻa kemika: pili i ka hiki ke pale aku i ka waika, alkalis, paakai, solvents a me na mea kemika.

Kūʻē ahi: e pili ana i ka hiki o ka mea ke pale aku i ka puhi ahi i ka wa e pili ana me ka lapalapa ana a i ole e keakea i ka hoomau ana o ka puhi ana ke kaawale mai kahi lapalapa.

Kūleʻa i ka wā: e pili ana i ka ʻike ʻana i ka lā, ka wela a me ke anu, ka makani a me ka ua a me nā kūlana climatic ʻē aʻe.

ʻelemakule: ho'ōla i ka colloid i ka hana, mālama ʻana a me ka hoʻohana ʻana i ke kaʻina hana, ma muli o nā kumu o waho (wela, māmā, oxygen, wai, nā kukuna, nā mana mechanical a me nā media kemika, a me nā mea ʻē aʻe), kahi ʻano o nā hoʻololi kino a i ʻole kemika, no laila ka polymer material crosslinking brittle, māwae lāʻau, discoloration māwae, rough blistering, surface chalking, delamination flaking, ka hana o ka gradu deterioration o ka mechanical waiwai o ka lilo o ka poho o ka hiki ole ke hoʻohana, keia mea i kapaia ke kahiko. Ua kapa ʻia ke ʻano o kēia hoʻololi ʻana i ka ʻelemakule.

Dielectric mau: ʻike pū ʻia ʻo ka capacitance rate, induced rate (Permittivity). Hōʻike i kēlā me kēia "unit volume" o ka mea, i kēlā me kēia ʻāpana o ka "gradient hiki" hiki ke mālama i ka "ikehu electrostatic" (Electrostatic Energy) o ka Ehia. Ke ʻoi aku ka nui o ka "permeability" colloid (ʻo ia hoʻi, ʻoi aku ka maikaʻi o ka maikaʻi), a ʻelua kokoke i ka uea o kēia manawa, ʻoi aku ka paʻakikī o ka hiki ʻana i ka hopena o ka insulation piha, ʻo ia hoʻi, ʻoi aku ka maikaʻi o ka hana ʻana i kekahi degere. leakage. No laila, ʻo ka dielectric mau o ka mea insulating ma ka laulā, ʻoi aku ka liʻiliʻi o ka maikaʻi. ʻO ka dielectric mau o ka wai he 70, liʻiliʻi loa ka makū, e hoʻololi nui.

4. ka hapa nui o kaepoxy resin adhesivehe mea hoʻopili wela, aia nā hiʻohiʻona nui: ʻoi aku ka kiʻekiʻe o ka mahana ʻoi aku ka wikiwiki o ka hoʻōla ʻana; ʻO ka nui o ka hui ʻana o ka ʻoi aku ka wikiwiki o ka hoʻōla ʻana; He hanana exothermic ka hana ho'ōla.

 

 

 

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